School of Computer Science, Shanghai Jiao Tong University
Institute of Scalable Computing
上海交通大学 计算机学院
可扩展计算研究所
I am a Research Professor and Doctoral Supervisor in the School of Computer Science at Shanghai Jiao Tong University. My research sits at the intersection of computer architecture and design automation, with a focus on AI-specific processors, compilers, heterogeneous accelerators, and processing-in-memory / computing-in-memory (PIM/CIM) architectures — from 3-D IC test and neuromorphic computing to neural-network compression and large-model systems. I have published 160+ peer-reviewed papers (per DBLP), received two Best Paper Awards (DATE 2022, 2023), the IEEE TTTC E. J. McCluskey Doctoral Thesis Award (Asia 1st place, global finalist), and multiple best-paper nominations, and I was selected for the National Young Top-Notch Talent Program.
我是上海交通大学计算机学院的研究员、博士生导师。我的研究聚焦于 计算机体系结构与设计自动化/EDA 的交叉领域, 涉及 AI 专用处理器、编译器、异构加速器,以及存算一体(PIM/CIM)架构——从 3D-IC 测试、 神经形态计算,到神经网络压缩与大模型系统。 已在相关领域发表会议与期刊论文 160 余篇(以 DBLP 为准),两获最佳论文奖 (DATE 2022、2023),获 IEEE TTTC E. J. McCluskey 最佳博士论文奖 (亚洲第一、全球入围)及多次最佳论文提名,入选国家级青年人才计划。
A defining theme of my work is translating research into real products and standards. My 3-D IC test architecture was adopted into the IEEE P1838 standard; my neural-network compression technology was applied in one of China's first mass-produced computing-in-memory chips; and my team's sparse-compilation techniques have been merged into the open-source MindSpore framework. Alongside my academic role, I serve as Director of Huawei's Datacom Communication Processor Lab and Chief Scientist for heterogeneous communication processors, and as a Distinguished Scientist for high-performance computing at the Shanghai Qizhi Institute.
我的工作一以贯之的主题,是把研究成果落地为真实产品与标准:3D-IC 测试架构入选 IEEE P1838 国际标准;神经网络压缩技术应用于国内首批量产的存算一体芯片; 团队稀疏编译技术已合入开源MindSpore 框架。在学术角色之外,我担任 华为数通通信处理器实验室主任、异构通信处理器首席科学家, 并任上海期智研究院高性能计算杰出科学家。
Contact:联系方式: Office 521, SEIEE Building #3, 800 Dongchuan Road, Minhang, Shanghai 200240 · Tel +86-21-34208232 上海市闵行区东川路 800 号 电院 3 号楼 521 室 · 电话 +86-21-34208232
My group works across the full stack — device, circuit, architecture, compiler, and system — to break the memory wall and power wall for data-centric AI. Our publications cluster into seven directions (see the full DBLP-indexed list):
我的课题组从器件、电路、架构、编译到系统的全栈开展工作,目标是突破以数据为中心的 AI 所面临的 存储墙与功耗墙。我们的论文主要汇聚为七大方向(完整 DBLP 列表 见此处):
Research that ships. A selection of the partnerships and impact that connect my academic work to industry. 把研究落地成产品。以下为本人在产学研合作与技术转化方面的主要代表性实践。
Director & Chief Scientist for heterogeneous communication processors. Led joint research on PIM for communication systems, near-cache acceleration, sparse AI compilation, and optical-communication PIM; sparse-compilation techniques merged into MindSpore. Recognized with the Huawei Spark Award (2022) and the MOE–Huawei Smart Base "Outstanding Contribution Award" (2021).
任实验室主任兼异构通信处理器首席科学家,主导面向通信系统的存算一体(PIM)、近缓存加速、稀疏 AI 编译、光通信 PIM 等联合研究;稀疏编译技术已合入开源 MindSpore。获华为火花奖(2022)及教育部—华为智能基座突出贡献奖(2021)。
Neural-network compression technology applied in one of China's first mass-produced computing-in-memory chips and deployed across commercial scenarios — a key basis of the Wu Wenjun AI Science & Technology Award (chip category, 2nd prize).
神经网络压缩技术应用于国内首批量产的存算一体(CIM)芯片,并在多个商用场景落地——也是吴文俊人工智能科技奖(芯片类二等奖)的关键支撑。
Collaborations on DRAM failure prediction, DNN compression, and distributed-system I/O anomaly detection. Our FlexQuant dynamic-precision framework is in trial at Alipay, delivering ~40% faster LLM generation and >60% higher throughput.
合作方向包括 DRAM 失效预测、DNN 压缩、分布式系统 I/O 异常检测。我们的 FlexQuant 动态精度框架已在支付宝试点,LLM 生成本项目提速约 40%、吞吐提升超 60%。
Joint research on resource-sharing techniques for 3-D stacked-memory fault-tolerance architectures, contributing to the work honored with the ACM Shanghai Rising Star Award (2019).
面向 3D 堆叠存储器容错架构的资源共享技术联合研究,相关成果获得ACM 上海新星奖(2019)。
Low-power CNN deep-learning image-recognition algorithms, with outcomes adopted in ZTE products.
低功耗 CNN 深度学习图像识别算法,研究成果已应用于中兴产品。
BEVFormer acceleration and computing-in-memory architecture design for autonomous-driving platforms.
面向自动驾驶平台的 BEVFormer 加速与存算一体架构设计。
3-D IC test architecture adopted into the IEEE P1838 standard; MindSpore Community Technical Committee member (2023–). Co-founder and Secretary-General of ChinaDA (2018–).
3D-IC 测试架构入选IEEE P1838 标准;MindSpore 社区技术委员会委员(2023–);ChinaDA 共同发起人及秘书长(2018–)。
Full author lists below; Li Jiang* denotes corresponding author. 以下列出全部作者;蒋力*为通信作者。
Full publication list (160 formal publications, DBLP-aligned) →完整论文列表(160 篇正式发表,与 DBLP 对齐)→
Our group currently includes 2 faculty, 8 PhD students (plus 3 joint-program PhD students with the Shanghai Qizhi Institute), and 4 master's students (current enrollment; per the university enrollment system, Aug 2026), spanning AI compression, hardware–software co-optimization, and EDA compiler optimization.
课题组目前包含 2 位教研人员、8 名在读博士生(另有 3 名上海期智研究院联培博士生)、4 名在读硕士生(截至 2026 年 8 月,以学校学籍系统为准), 覆盖 AI 压缩、软硬件协同优化与 EDA 编译优化等方向。